Conductive materialSAM32 Series SnBi solderable Anisotropic conductive paste (Thermal compression bonding)

For terminal joining！
Lower profile and finer pitch


 

Features

  • Lower profile than connectors
    　⇒Thinner products (smartphone, OLED, LCD etc.)
  • Lower pressure (1 MPa or less): Comparing to　conventional ACF　and　ACP
    　⇒Low ltemp. solder alloy
    　　→①Dead space reduction
    　　　②Component mounting backside of SAM32 joining (space saving)
  • Applicable to Cu-OSP
    　⇒PCB cost reduction from Au plating
  • Process step reduction
    　⇒Pre-bonding not required
  • Cost reduction
    　⇒Repairable/ reworkable
  • Environmentally friendly material: RoHS compliant, Halogen-free, VOC-free
  • Applicable pitch size:
    　 Applicable L/S
    　・100/100μm (Solder particle size：5~ 20μm)
    　・50/50μm　(Solder particle size： 3~ 10μm）
    　・30/30μm　 (Solder particle size：2~ 6μm)（Under Development）

※This product is under the licence of Panasonic Smart Factory SolutionsCo., Ltd.

Application

  • Wind / Solar power generation
  • Mobile device
  • Household appliances
  • Automotive
  • LED
  • Chip component
  • FPC
  • Industrial machinery

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