Solder Paste for Multiple ApplicationTLF-401-11 Bi-type low melting point solder paste

For low-temperature reflow profile!

  • TLF-401-11 0.4mmピッチの印刷性
    Printability at 0.4mm pitch

Features

  • For low-temperature air reflow
  • Stable printability with continuous printing
  • Good solderability to various components

Application

  • Mobile Device
  • Household appliances
  • Automotive
  • LED
  • FPC
  • Chip component
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