Solder Paste for Multiple ApplicationTLF-204-NH Halogen-Free Solder Paste

Excellent wettability and heat resistance!

  • TLF-204-NH QFP端面へのぬれ上がり(N2リフロー)
    Wetting of QFP lead ends(N2 Reflow)
  • TLF-204-NH QFP端面へのぬれ上がり(大気リフロー)
    Wetting of QFP lead ends(Air Reflow)

Features

  • Halogen compounds are not intentionally added
  • Stable printability with continuous printing
  • Good solderability in air reflow
  • Suitable with conventional lead-free standard reflow profile

Application

  • Mobile Device
  • Household appliances
  • Automotive
  • LED
  • FPC
  • Chip component

Specifications

項目 TLF-204-NH Test method
Alloy Composition Sn/3.0Ag/0.5Cu JIS Z 3282 (1999)
Melting Point (°C) 216~220 DSC measurement
Particle Size of Solder Powder (μm) 25~41 Laser analysis
Flux Content (%) 12 JIS Z 3284 (1994)
Chlorine Content (%) 0 JIS Z 3197 (1999)
Viscosity (Pa.s) 210 JIS Z 3284 (1994)
Thixotropy Index 0.55 JIS Z 3284 (1994)
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