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- Solder Paste
- Under development Lead Free Solder Paste for Jet-Dispensing
Lead Free Solder Paste for Jet-DispensingUnder development Lead Free Solder Paste for Jet-Dispensing
For jet-dispensing
Features
- Good jet - dispensing performance
- Wide clearance (≧2mm)
- Continuos dosage
- No Satellite formation
- Good shape of jetted dots
Application
- Mobile Device
- Household appliances
- Automotive
- LED
- FPC
- Chip component
Specifications
| Items | TLF-204F-JD10HF | Test method |
|---|---|---|
| Solder Alloy | SAC305 | - |
| Particle size (μm) | 10- 25μm | Laser scattering method |
| Flux contents (%) | 16-18wt% | JIS Z 3284 (1994) |
| Viscocity(@25deg.C) (Pa.s) | 20-35Pa・s | E-type viscometer |
| Nozzle size (mmΦ) | ≧0.25mmΦ | - |
| Halogen/Halogen-free | Halogen-free | IEC 61249-2-21 |
Catalog Download
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