Joint Reinforcement PasteSAM10-401-27 Low teperature Sn/Bi alloy type conductive adhesive paste
For chip components and camera modules!
Features
- Soldering and thermosetting at the same time by air reflow at low temperature(160℃/4min)
- Lead-free alloy composition
- Applicable for 0603 chip components
- Halogen-free and VOC-free
- High reliability without cleaning
- Stable printability with continuous printing
Application
- Wind/Solar power generation
- Mobile Device
- Household appliances
- Automotive
- LED
- FPC
- Chip component
- Industrial machinery
- Camera Module
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