Joint Reinforcement PasteSAM10-401-27 Low teperature Sn/Bi alloy type conductive adhesive paste

For chip components and camera modules!

  • SAM10-401-27


  • Soldering and thermosetting at the same time by air reflow at low temperature(160℃/4min)
  • Lead-free alloy composition
  • Applicable for 0603 chip components
  • Halogen-free and VOC-free
  • High reliability without cleaning
  • Stable printability with continuous printing


  • Wind/Solar power generation
  • Mobile Device
  • Household appliances
  • Automotive
  • LED
  • FPC
  • Chip component
  • Industrial machinery
  • Camera Module