Solder Paste for Multiple ApplicationTLF-204-75 Cleanable No-Clean Solder Paste

Excellent cleanability!

  • TLF-204-75 リフロー後
    After reflow
  • TLF-204-75 炭化水素系洗浄剤にて洗浄後
    Cleaning with hydrocarbon-based detergent

Features

  • Flux residue can easlily be removed  using hydrocarbon-base or semi-aqueous detergents
  • Good solderablity with fine pitch components: 0.4mmP QFP
  • Good solderbility/ wettability to various components

Application

  • Mobile Device
  • Household appliances
  • Automotive
  • LED
  • FPC
  • Chip component

Specifications

ITEM TLF-204-NH Test method
Alloy Composition Sn96.5/Ag3.0/Cu0.5 JIS Z 3282 (1999)
Melting Point (°C) 216~220 DSC measurement
Particle Size of Solder Powder (μm) 20~38 Laser analysis
Flux Content (%) 11.2 JIS Z 3284 (1994)
Chlorine Content (%) 0 JIS Z 3197 (1999)
Viscosity (Pa.s) 200 JIS Z 3284 (1994)
Thixotropy Index 0.58 JIS Z 3284 (1994)
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