Solder Paste for Multiple ApplicationTLF-204-189 Solder paste for void and flux scattering reduction

Void/ flux scattering reduction!

  • TLF-204-189

Features

  • Void reduction
  • Less flux  scattering
  • Low flux residues
  • Printability improved

Application

  • Mobile Device
  • Household appliances
  • Automotive
  • LED
  • FPC
  • Chip component

Catalog Download

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