High heat-resistant solder paste for automotiveTLF-286 Series

Highly reliablity solder paste for automotive


◎For automotive

  • Ensure high reliability under harsh environments
     ⇒Control solder deformation against the stress during thermal cycles
     ⇒Control Cu6Sn5 coarsening in solder filet
     ⇒Control IMC coarsening in the layer
  • Improve product reliability by preventing flux residues from getting cracked

  • ※ Solder alloy composition: Patent No. 6047254


  • Wind/Solar power generation
  • Household appliances
  • Automotive
  • Chip component
  • Industrial machinery