Solder Paste for Fine-pitch

• Type6
  TLF-204G-HF27

  
  

  

  
  

Low Silver Content  Lead-free Solder Paste

• Low silver content lead-free solder paste GP-213 Series

  

• Low silver(1.0Ag) content lead-free solder paste GP-217 Series

  

• TLF-204&GP Series

  

Solder Paste Developed for Localised Heating

• LSM Series

  

• LSM10-204-02

  

Lead Free Solder Paste for Jet-Dispensing

• Solder paste for JET-DISPENSING

  
  

  

  
  

Joint Reinforcement Paste

• Low temperature SAM10-401-27

  

• Thermal compression bonding SAM32 Series

  

Silver Paste

• VL-10

  

UV-Curable Solder Mask for Multiple Application

• High-resolution solder mask USR-2G Series

  

• Carbon paste for under-coating  USR-11G-11HF

  

Transparent Insulation Material

• Transparent insulation material for ink-jetting JIM-30-13

  

Photo-Imageable Solder Mask for Wide Application

• DSR-8000 Series

  
  

  

  
  

Direct-Imaging Solder Mask

• Solder mask applied by spray coating  DSR-8000P13 Series

  

• Direct-Imaging Solder Mask for FPC  APB-300-21

  

Solder Mask for FPC

• Liquid solder mask for FPC  PAF-300-8 Series

  

• Low spring-back solder mask for FPC  PAF-300-14 Series

  

• Black absorption material for  LED  APB-300 Series

  

• Black absorption material for  LED  APB-300-11

  

Black Solder Mask

• DSR-330S46-15BK

  

Heat-resistant adhesive for multilayer FBC

• FBR-EZ Series

  

White Reflective Material for LED

• White reflective material for LED (Rigid PCB)RPW-200-01

  

• RPW-300-13TR-1

  

• UV curable white reflective solder mask for LED (rigid) RPW-20-13-150+RPW-20-17S

  

Black Absorption Material for LED

• Black Absorption Material for LED APB-200-11

  

• Black Absorption Material for LED APB-300 Series

  

OSP

• Aqueous preflux for gold plated PCB  WPF-27

  

• Aqueous preflux for gold plated PCB WPF-21

  

• Surface protection agent that prevents oxidation of copper foil                       WPF-207

  

Carbon Paste

• MRX-713J-A

  

Transparent insulation material for ink-jetting

• Transparent insulation material for ink-jettingJIM-30-13

  

Solder Paste for Laser Soldering

• LSM Series

  

• LSM10-204-02

  

N2 REFLOW SYSTEM

• TNV-EM P/X series

  

• TNV-EM G series

  

• TNV-EM E Series

  

• TNV-EM Mini Series

  

• TNR15 Series

  

• TNV-EM Ver2 Series

  

Dual Conveyor N2 Reflow System

• TNV-EMD / EMT Series

  

 

External Flux Collection Systsem

• FPC-02SH

  

Heat Bonder for SAM（Self-Assembling-Material)

• TCB50-50M

  

PCB Handling Conveyour system

• Automatic Loader/Unloader

  

• PCB Cleaning Conveyor

  

• Linking Conveyor

  

• Inspection Vonveyor

  

• Manual Insertion Conveyor

  

PSA-Type Nitrogen Gas Generator

• KN4 series

  

Slect from Other Application

• Semiconductor package
• Wind/Solar power generation
• Mobile Device
• Household appliances
• Automotive
• LED
• FPC
• Chip component
• Industrial Machinery

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