Solder Paste for Multiple ApplicationTLF-801-17 In-type low melting point solder paste

Excellent wettability and  printability !

  • TLF-801-17 QFPリードに対する優れたぬれ性
    Excellent wettability to QFP lead 
  • TLF-801-17 0.4mmピッチの印刷性
    Printability of 0.4mm pitch

Features

  • Good solderability/wettability
  • Less solder balls
  • Excellent printability

Application

  • Mobile Device
  • Household appliances
  • Automotive
  • LED
  • FPC
  • Chip component

Specifications

ITEM TLF-801-17 TLF-401-11 Test method
Alloy Composition Sn / 3.5Ag / 0.5Bi / 8.0In Sn / 58Bi JIS Z 3282 (1999)
Melting Point (°C) 216~220 139 DSC measurement
Particle Size of Solder Powder (μm) 25~41 25~45 Laser analysis
Flux Content (%) 11.5 9.5 JIS Z 3284 (1994)
Chlorine Content (%) 0.24 0.0 JIS Z 3197 (1999)
Viscosity (Pa.s) 220 210 JIS Z 3284 (1994)
Thixotropy Index 0.58 0.59 JIS Z 3284 (1994)
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