High Reliability Lead-free Solder PasteTLF-204-19ACα High reliability Solder paste for narrow pitch assembling

Narrow pitch assembles! Bonding reliability ensures! Insulation reliability improved!

  • TLF-204-GTS-VR1


  • We improved shape retention on heating process by controlling viscosity reduction on pre-heating process
  • We improved wettability than rosin paste due to optimize flux combination
  • Improved migration resistance by controlling flux-residue clacking


  • Wind/Solar power generation
  • Household appliances
  • Automotive
  • Chip component
  • Industrial machinery

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