Heat-resistant adhesive for multilayer FBCFBR-EZ Series Resin Film

Highly flexible with high Tg, strong adhesion and hologen-free!

  • FBR-EZ77
    FBR-EZ77

Features

  • High Tg and strong adhesion
  • Heat resistance with halogen-free
  • Excellent reliability/migration resista

Application

  • Wind/Solar power generation
  • Mobile Device
  • Household appliances
  • Automotive
  • LED
  • FPC
  • Chip component
  • Industrial machinery

Specifications

ITEM Conditions Units Resin Film RCC
FBR-EZ77 CBR-EZ78
Tg (TMA) A 175 154
C.T.E α1 A ppm/℃ 59 62
Film Properties Tensile Modulus A GPa 1.9 1.8
Breaking Strength A MPa 94 70
Breaking Strain A % 9.6 8.1
Peel Strength 銅箔
Cupper Foil
Mat Side A kN/m 1.2 1.2
CZ Side 0.8 0.78
Polyimide A 0.6 0.6
Aluminium A >2.0 >2.0
 Folding Endurance(R=0.38) 20℃  times 262  (Film 50μm) 368  (Film 50μm)
 Flammability(UL94) A -  Halogen Free VTM-0  Halogen Free VTM-0
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