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Top > Products Information > Electro Chemical Materials/Soldering System > Wave Soldering System Air Inclined Wave Soldering System > HC33-32LF2

HC33-32LF2 AIR INCLINED WAVE SOLDERING SYSTEM(WITH Mr.FLIP)
AIR INCLINED WAVE SOLDERING SYSTEM(WITH Mr.FLIP)
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FEATURES
 (1) Completely lead-free
FLIP type solder pool, high precision preheat.
 (2) Automatic secondary jet nozzle adjustment system
Remote control with note-type personal computer. (Option)
 (3) Central control with touch panel
 (4) Applicable to solder collection system TSS 14000 (Option)
 (5) Fully close hood and operation by monitoring with monitor camera (Option)
 (6) Standard gear for spot cooler!!
Optimum soldering has been realized.

SPECIFICATIONS
Applicable boards MAX. W330×L350×t1.6 mm
MIN. W 50×L120×t0.6 mm
Inclined angle of conveyor 3∼5°
Conveyor speed 0.5∼2.0 m/min
Dimensions of machine W1320×L3200×H1600 (mm)
Weight (Excluding solder) Approx.1400kg
Soldering Capacity (Sn-Pb) Approx.360kg
Imput power source AC200V-50/60Hz-3Φ 28kVA
NEW Pre-heater unit
NEW Pre-heater unit
Cooling unit
Cooling unit
Spot cooler
Spot cooler
Control unit
Control unit
HC33-32LF2(New type preheater installed on board)
HC33-32LF2(New type preheater installed on board)
  Cooling unit
Setting
Preheater 180℃,150℃,130℃
C/V 1.0m/min


Comparison with conventional preheater units
-Improvement in heating capacity
-Decline in inter-board temperature difference, ΔT, owing to efficient heating

Better soldering is realized.
  A pair of box-construction cooling units are provided on the top and bottom so as to enclose the base board. They combine to offer centralized cooling for the entire unit.
The cooling start position can be adjusted by sliding the top cooling unit in parallel with the transfer conveyer and, by doing so, the parts mounted on the board are protected against overheating effectively.
The sample profile shows that the upper and lower surfaces are cooled positively as intended.


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