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Top > Products Information > Electro Chemical Materials/Soldering System > Reflow Soldering System Lead-Free Air Reflow System >TNE61-6212EM

TNE61-6212 N2 REFLOW SYSTEM
TNE61-6212
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FEATURES

Energy-saving measures
Multitiered layer insulation structure + floating structure

Twice the thermal resistance compared to the past

Reduce electricity consumption

30% reduction in power consumption compared to conventional model
Factory load reduction
Reduction in air conditioner fee


Energy conservation mode

Daytime rest and arrangement time electricity bill reduction
Energy conservation of about 40% compared to normal mode


Energy conservation control

Multi grouping flip-flop
40% reduction in start-up time compared to the past
Peak electric power (W/H) can be decreased



Efficiency in production line
High speed production design

Maximum XL size PCB supported (width 610mm)

Dual transportation (option available)

Improve efficiency of Reflow Process via Dual-Lane


Flux collection
FPC Flux Collection System (option available)
more
SPECIFICATIONS
  TNB40-547PT
Applicable boards MAX W610×L650 (mm) MIN W50×L50 (mm)
Component height Upper 10,15,20,25,30mm
Lower 10,15,20,25,30mm
Circuit board put allowance 4mm
N2 Gas supply 99.99%MAX 0.4~0.7Mpa 400NL/min
Flow height from floor 900 ±20mm
Power source AC200V-50/60Hz-3φ 57kVA 165A(at multi grouping flipflop start)
Dimensions of machine W1720×L6240×H1370(mm)
Weight approx.3900kg
STANDARD FUNCTIONS
 - HDD Less PC
 - Oxygen analyzer
 - Activated carbon reproduction unit
 - MULTI-LANGUAGE VERSION (JAPANESE, ENGLISH, CHINESE)
 - Flux collection unit
 - PCB stop alarm
 - Fan inverter individually controlable

OPTIONAL UNITS
 - Automatic Width Control
 - Warp preventive unit
 - Unintrruptible Power Supply(UPS)
 - Water cooling unit
 - Oxygen density controller
 - Area sensor
 - Maintenance mode
 - Energy-saving mode


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