Low Silver Content Lead-free Solder PasteGP-213 Series Low silver content lead-free solder paste

Same workability as SAC305 solder paste. Excellent joint reliability and wettability.Recommended low silver lead-free alloy by JEITA (Japan Electronics and Information Technology Industries Association)

  • GP-213Series

Features

  • Excellent wettability  using newly developed activators
  • Almost the same melting point as SAC305(approx. 220℃). Standard SAC305 reflow profile applicable
  • Recommended alloy composition by JEITA
  • ※"Halogen-free" is defined in IEC:61249-2-21 and IPC:4101 B.
    Solder alloy: Sn-2.0Bi-1.0Ag-0.7Cu (second-generation reflow soldering paste, recommended composition by JEITA) is also available.

Application

  • Wind/Solar power generation
  • Mobile Device
  • Household appliances
  • Automotive
  • LED
  • FPC
  • Chip component
  • Industrial machinery

Catalog Download

  • Download the catalog for this product
TOP